SEMICONDUCTOR CHIP PACKAGE WITH EXPOSED HEAT RADIATING PLATE FOR PREVENTING MOLDING FAILURE AND MAXIMIZING HEAT RADIATING EFFECT, AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A semiconductor chip package and a manufacturing method thereof are provided to prevent molding failure due to the flowability of a molded resin and to maximize heat radiating effect by using an exposed heat radiating plate. CONSTITUTION: A semiconductor chip(110) with a plurality of bonding pads(111) is mounted on a die pad(121). Inner leads(123) are arranged along a periphery of the die pad. The bonding pads and the inner leads are electrically connected with each other by using bonding wires(131). A package body(135) encapsulates selectively the resultant structure. A heat radiating plate(141) is installed on the package body and connected with the semiconductor chip through a plurality of connecting portions(143).