| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a piezoelectric transducer element which copes with the miniaturization (thinning) and improves the yield. <P>SOLUTION: The method of manufacturing a piezoelectric transducer element having a thick-walled vibrating part having a thicker central portion than a peripheral edge of a piezoelectric substrate has a first etching step of etching first and second gaps after covering element regions of the large piezoelectric substrate, corresponding to the piezoelectric transducer elements, support regions adjacent to the element regions across the first gaps and frame regions adjacent to the support regions across the second gaps with a protective film; and a second etching step of etching the piezoelectric substrate after covering vibrating regions corresponding to the vibrating part, the support regions, and the frame regions with the protective film. After piercing the first gaps by the first and second etching steps with leaving narrow joints tying the element regions and the support regions, the joints are bent and broken to obtain individual piezoelectric transducer elements. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
