发明名称 VISCOSITY REDUCIBLE RADIATION CURABLE RESIN COMPOSITION
摘要 The invention relates to a viscosity reducible radiation curable composition comprising at least one radiation curable component and a filler, wherein the composition has the properties i) a yield stress value of < 1100 Pa, ii) a viscosity (at a shear rate of 1 sec between 1 and 1500 Pa.sec, and iii) a filler settling speed less than 0.3 mm/day.
申请公布号 WO2005007759(A2) 申请公布日期 2005.01.27
申请号 WO2004NL00517 申请日期 2004.07.16
申请人 DSM IP ASSETS B.V.;YOU, XIAORONG 发明人 YOU, XIAORONG
分类号 B29C41/00;B29C67/00;C08L51/08;C09D151/08;G03F7/00;G03F7/004;G03F7/038 主分类号 B29C41/00
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