| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition which gives a coating film having similar resin properties to those of a polyimide and exhibiting high strength and excellent flexibility by only a drying step at 250°C or lower without necessitating an imidization step, and a semiconductor device. <P>SOLUTION: The resin composition comprises (A) an aromatic thermoplastic resin which is soluble in a polar solvent at room temperature, (B) an aromatic thermoplastic resin which is insoluble in the polar solvent at room temperature but gets soluble when heated, and the polar solvent, where (A) the aromatic thermoplastic resin soluble in the polar solvent at room temperature is a modified polyamideimide resin obtained by causing a mixture of (a) an aromatic polyisocyanate, (b) a trihydric polycarboxylic acid bearing an acid anhydride group and (c) a dicarboxylic acid represented by general formula (I) (wherein R is a 1-12C alkylene group; X is a 1-12C alkylene group or a phenylene group; and m and n are each an integer of 1-20) to react in the polar solvent. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
