发明名称 HIGH-FREQUENCY PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide a high-frequency package excellent in matching characteristics. SOLUTION: The high-frequency package is equipped with a base plate 11, a dielectric frame 12 surrounding a part of a space on the base plate 11, and a high-frequency transmission line equipped with a first section S1 which is located on the outer side of the dielectric frame 12 penetrating into the inside of the dielectric frame 12 from the outside, a second section S2 which penetrates through the dielectric frame 12, and a third section S3 which is located on the inner side of the dielectric frame 12. The high-frequency transmission line in the first section S1 is composed of a first line S11 which is constant in width, and has a prescribed length and a second line part S12 which is smaller in width and length than the first line part S11, kept constant in width, and has a prescribed length. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005026326(A) 申请公布日期 2005.01.27
申请号 JP20030187882 申请日期 2003.06.30
申请人 TOSHIBA CORP 发明人 IKUMA YOSHIYUKI
分类号 H01L23/02;(IPC1-7):H01L23/02 主分类号 H01L23/02
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