| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board by which a conductor pattern can be made fine by using an inexpensive and simple subtractive method at the time of manufacturing a circuit board. SOLUTION: The method of manufacturing the circuit board includes a step of patterning a first resist (4) on the thin second metallic layer (20) of a substrate in which a first metallic layer (2) and the second metallic layer (20) are formed on the surface of an insulating substrate (1), a step of only selectively etching the second metallic layer (20) through the opening of the first resist (4), and a step of half-etching the first metallic layer (2) through the first resist (4) and first masking composed of the second metallic layer (20) immediately under the resist (4). The method also includes a step of applying a positive liquid second resist (12) to the half-etched surface of the metallic layer (2), a step of protecting the second resist (12) under the first masking by exposing and developing the resist (12) from the above of the first masking, and a step of removing the first and second resists (4) and (12) by again etching the first metallic layer (2) through the first masking and second masking composed of the protected second resist (12). COPYRIGHT: (C)2005,JPO&NCIPI |
