发明名称 High permeability composite films to reduce noise in high speed interconnects
摘要 A transmission line circuit provides a structure for improved transmission line operation on integrated circuits. The transmission line circuit includes a first layer of electrically conductive material on a substrate. A first layer of insulating material is formed on the first layer of the electrically conductive material. A number of high permeability metal lines are formed on the first layer of insulating material. The number of high permeability metal lines includes composite hexaferrite films. A number of transmission lines is formed on the first layer of insulating material and between and parallel with the number of high permeability metal lines. A second layer of insulating material is formed on the transmission lines and the high permeability metal lines. The transmission line circuit includes forming a second layer of electrically conductive material on the second layer of insulating material.
申请公布号 US2005017327(A1) 申请公布日期 2005.01.27
申请号 US20040914331 申请日期 2004.08.09
申请人 MICRON TECHNOLOGY, INC. 发明人 FORBES LEONARD;AHN KIE Y.;AKRAM SALMAN
分类号 G11C7/18;H01L23/522;(IPC1-7):H01P5/12 主分类号 G11C7/18
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