发明名称 |
High permeability composite films to reduce noise in high speed interconnects |
摘要 |
A transmission line circuit provides a structure for improved transmission line operation on integrated circuits. The transmission line circuit includes a first layer of electrically conductive material on a substrate. A first layer of insulating material is formed on the first layer of the electrically conductive material. A number of high permeability metal lines are formed on the first layer of insulating material. The number of high permeability metal lines includes composite hexaferrite films. A number of transmission lines is formed on the first layer of insulating material and between and parallel with the number of high permeability metal lines. A second layer of insulating material is formed on the transmission lines and the high permeability metal lines. The transmission line circuit includes forming a second layer of electrically conductive material on the second layer of insulating material.
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申请公布号 |
US2005017327(A1) |
申请公布日期 |
2005.01.27 |
申请号 |
US20040914331 |
申请日期 |
2004.08.09 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
FORBES LEONARD;AHN KIE Y.;AKRAM SALMAN |
分类号 |
G11C7/18;H01L23/522;(IPC1-7):H01P5/12 |
主分类号 |
G11C7/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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