发明名称 |
Thermal paste for improving thermal contacts |
摘要 |
A thermally conductive paste including porous agglomerates of carbon particles dispersed in a paste-forming vehicle is disclosed. The paste is useful as a thermally conductive interface material between a heat or cold source and an object. The paste is particularly useful as a thermally conductive interface material between a heat source and a heat sink. Apparatus and a method of removing heat from a heat source utilizing thermally conductive pastes of the present invention are also disclosed. |
申请公布号 |
US2005016714(A1) |
申请公布日期 |
2005.01.27 |
申请号 |
US20040807487 |
申请日期 |
2004.03.23 |
申请人 |
CHUNG DEBORAH D.L. |
发明人 |
CHUNG DEBORAH D.L. |
分类号 |
B32B3/26;B32B5/16;C08K3/00;F28D9/00;F28F13/00;H01L;H01L23/34;(IPC1-7):F28D9/00 |
主分类号 |
B32B3/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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