发明名称 Thermal paste for improving thermal contacts
摘要 A thermally conductive paste including porous agglomerates of carbon particles dispersed in a paste-forming vehicle is disclosed. The paste is useful as a thermally conductive interface material between a heat or cold source and an object. The paste is particularly useful as a thermally conductive interface material between a heat source and a heat sink. Apparatus and a method of removing heat from a heat source utilizing thermally conductive pastes of the present invention are also disclosed.
申请公布号 US2005016714(A1) 申请公布日期 2005.01.27
申请号 US20040807487 申请日期 2004.03.23
申请人 CHUNG DEBORAH D.L. 发明人 CHUNG DEBORAH D.L.
分类号 B32B3/26;B32B5/16;C08K3/00;F28D9/00;F28F13/00;H01L;H01L23/34;(IPC1-7):F28D9/00 主分类号 B32B3/26
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