发明名称 |
PLASMA TREATMENT METHOD AND PLASMA TREATMENT DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plasma treatment method hardly degrading plasma treatment capability. <P>SOLUTION: This plasma treatment device has a plurality of electrodes 1 and 2 disposed oppositely to each other, and a gas passage 36, and generates plasma 3 in the gas passage 36 under pressure in the vicinity of atmospheric pressure by introducing a gas into the gas passage 36 and by applying a voltage between the electrodes 1 and 2 opposite to each other. This application is also related to this plasma treatment method for emitting the plasma 3 from the gas passage 36 to supply it to a surface of a treatment object 4. The emission direction of the plasma 3 is tilted toward the transfer direction of the treatment object 4. Air can be collected and supplied to a spraying position of the plasma 3 by sucking the air around the treatment object 4 into the flow of the plasma 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2005026171(A) |
申请公布日期 |
2005.01.27 |
申请号 |
JP20030270127 |
申请日期 |
2003.07.01 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
SAWADA KOJI;TAGUCHI NORIYUKI;YAMAZAKI KEIICHI;SHIBATA TETSUJI |
分类号 |
H05H1/24;B01J19/08;B08B7/00;C23C4/12;H01L21/3065;H01L21/31 |
主分类号 |
H05H1/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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