发明名称 PLASMA TREATMENT METHOD AND PLASMA TREATMENT DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma treatment method hardly degrading plasma treatment capability. <P>SOLUTION: This plasma treatment device has a plurality of electrodes 1 and 2 disposed oppositely to each other, and a gas passage 36, and generates plasma 3 in the gas passage 36 under pressure in the vicinity of atmospheric pressure by introducing a gas into the gas passage 36 and by applying a voltage between the electrodes 1 and 2 opposite to each other. This application is also related to this plasma treatment method for emitting the plasma 3 from the gas passage 36 to supply it to a surface of a treatment object 4. The emission direction of the plasma 3 is tilted toward the transfer direction of the treatment object 4. Air can be collected and supplied to a spraying position of the plasma 3 by sucking the air around the treatment object 4 into the flow of the plasma 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005026171(A) 申请公布日期 2005.01.27
申请号 JP20030270127 申请日期 2003.07.01
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 SAWADA KOJI;TAGUCHI NORIYUKI;YAMAZAKI KEIICHI;SHIBATA TETSUJI
分类号 H05H1/24;B01J19/08;B08B7/00;C23C4/12;H01L21/3065;H01L21/31 主分类号 H05H1/24
代理机构 代理人
主权项
地址