STACK CHIP DEVICE WITH VARIOUS EQUIVALENT INDUCTANCE VALUES TO ADJUST VARIOUS INDUCTANCE VALUES TO DESIRED VALUE

摘要

PURPOSE: A stacked chip device with various equivalent inductance values is provided to adjust various inductance values to desired value by stacking the first and second sheets wherein the first region of the first conductive pattern is connected to the first and second external terminals and at least one end of the second conductive pattern is connected to the third external terminal. CONSTITUTION: The first regions are formed both confronting end parts of the first conductive pattern(210). The first region are connected by the second region having a predetermined inductance value. At least one of the first sheet(201) has the first conductive pattern composed of the first and second regions. The second conductive pattern(211) crosses both confronting end parts of at least one of the second sheet(202) in a direction crossing the direction that the first regions are interconnected. The first regions of the first conductive pattern are connected to the first and second external terminals(230,231), and at least one end part of the second conductive pattern is connected to the third external terminal(232). The first and second sheets are stacked.