发明名称 Semiconductor device and package product of the semiconductor device
摘要 A semiconductor device includes, a circuit constituting section having a function circuit and an externally-drawing electrode, connected to the function circuit, on a surface of the circuit constituting section. An insulating layer is provided on a side of a rear surface of the circuit constituting section. The insulating layer has a face opposite to the circuit constituting section, which has an area that is larger than an area of the rear surface of the circuit constituting section.
申请公布号 US6847121(B2) 申请公布日期 2005.01.25
申请号 US20020223658 申请日期 2002.08.20
申请人 SHARP KABUSHIKI KAISHA 发明人 DOTTA YOSHIHISA;TAMAKI KAZUO
分类号 H01L21/60;H01L21/68;(IPC1-7):H01L23/48 主分类号 H01L21/60
代理机构 代理人
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