发明名称 INSPECTION APPARATUS FOR SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an inspection apparatus for a semiconductor device, for quickly and effectively radiating heat of a semiconductor device generating during a test, and for enabling correct test by keeping a test temperature constant without being influenced by the heat generating from the semiconductor device. SOLUTION: The inspection apparatus for a semiconductor device for testing durability of the semiconductor device against a temperature, comprises: a match plate; a contact module connected with the match plate, and having a radiating part radiating the heat generating from the semiconductor device to the outside and a test part for press-contact of lead wires of the semiconductor device; and an insert module disposed under the contact module, and having a semiconductor device housing part in which the semiconductor device is mounted. An auxiliary radiating member is disposed under the insert module to radiate the heat from the semiconductor device to the outside. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005017275(A) 申请公布日期 2005.01.20
申请号 JP20040096932 申请日期 2004.03.29
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 RYU JE-HYOUNG;KIM TAE-GYU;YIM SOON-KYU;LEE SUNG-JIN;RI SHUNKO
分类号 G01R31/26;G01R1/04;G01R31/28;G01R31/30;(IPC1-7):G01R31/30 主分类号 G01R31/26
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