发明名称 CURING APPARATUS AND CURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a curing apparatus and a curing method capable of improving the adhesion accuracy between a 1st member and a 2nd member by shortening the curing time of an adhesive. SOLUTION: The curing apparatus 10 functions to fix the 1st member 30 and the 2nd member 34 to each other by curing the adhesive 32. This apparatus 10 comprises a pressing section 40 for supporting the 1st member 30 and pressing the 2nd member 40, a flash light irradiation section 22 for preliminarily curing the adhesive 32 by irradiating the adhesive 32 with flash light of high intensity with short pulses, and an ultraviolet irradiation section 26 for fully curing the adhesive 32 by irradiating the preliminarily cured adhesive 32 with ultraviolet radiation. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005015600(A) 申请公布日期 2005.01.20
申请号 JP20030181359 申请日期 2003.06.25
申请人 SEIKO EPSON CORP 发明人 MIYASHITA TAKESHI;KATAOKA SEIICHI
分类号 C09J5/00;(IPC1-7):C09J5/00 主分类号 C09J5/00
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