发明名称 METHOD AND DEVICE FOR MOUNTING SOLDER BALL
摘要 PROBLEM TO BE SOLVED: To provide a method for mounting a solder ball which improves efficiency by performing even detecting of a mistake in ball mounting in parallel to another operation so as to avoid occurrence of a temporal loss in the operation. SOLUTION: First, after supplying a flux to the prescribed position of a substrate 2 by flux transferring heads 5 and 6, the method mounts a solder ball at the prescribed position by ball mounting heads 3 and 4 having absorption nozzles 15 and 16. Second, ball mounting heads and the flux transferring heads are alternately and plurally provided at an intermittently-rotated head supporting means 10. Third, when the rotation of the head supporting means is stopped, operation of absorbing the solder ball with the absorption nozzle, operation of sticking the flux to the tip of a flux pin 18, operation of transferring the flux to the substrate with a flux transferring pin, operation of mounting the solder ball by the ball mounting heads, and operation of testing the presence/absence of the solder ball by the absorption nozzle after mounting, are performed. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005019706(A) 申请公布日期 2005.01.20
申请号 JP20030182859 申请日期 2003.06.26
申请人 SHIBUYA KOGYO CO LTD 发明人 MURATA KENSEI
分类号 H01L21/60;B23K3/06;H01L21/48;H01L23/12;H05K3/34;(IPC1-7):H05K3/34 主分类号 H01L21/60
代理机构 代理人
主权项
地址