发明名称 BARREL PLATING DEVICE, AND BARREL PLATING SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a barrel plating device where the fluidization of muddy substance caused by the circulation of a plating liquid and its intrusion into the plating liquid are securely suppressed, and the expected circulation of the plating liquid can effectively be performed. SOLUTION: The inside of a plating tank 1 is divided into a plating chamber 6 and two anode chambers 7 by two screens 5, so that, even if a convection current is produced on a plating liquid PL in the plating chamber 6 by the rotation of a barrel 8, its influence is hard to be exerted on a plating liquid PL in the two anode chambers 7. Further, the plating liquid PL fed from the liquid feed ports 15a of two liquid feed pipes 15 into the plating chamber 6 is allowed to flow from the plating chamber 6 into the two anode chambers 7 through the mesh part 5a of each screen 5, so that the fluidization and diffusion of muddy substance caused by the flow of the plating liquid PL can be prevented as possible. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005015887(A) 申请公布日期 2005.01.20
申请号 JP20030185284 申请日期 2003.06.27
申请人 TAIYO KAGAKU KOGYO KK 发明人 YOSHIKAWA TAKEFUMI;TOKISAWA ICHIRO;ISHIHARA SHOJI;SATO FUSO
分类号 C25D17/00;C25D17/12;C25D17/20;C25D21/10;(IPC1-7):C25D17/00 主分类号 C25D17/00
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