THROUGH-HOLE STRUCTURE, WIRING BOARD, AND ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a through-hole structure that can reduce a signal attenuation and waveform distortion which become problems when high-frequency signals are transmitted through a though hole. SOLUTION: The electromagnetic couplings between pad conductors 300 and 301 provided at the ends of an embedded through hole and power-supply solid layers facing the pad conductors 300 and 301 are reduced by respectively providing clearances 400 and 401 in the power-supply mat layers. COPYRIGHT: (C)2005,JPO&NCIPI