| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical pickup device inexpensive and high in assembling workability, and capable of preventing the crossing of wiring patterns on a flexible substrate without needing any separate components and without forming a multilayer structure. <P>SOLUTION: This optical pickup deice 30 is provided with a hologram laser 31 having a plurality of lead terminals 46 and a flexible substrate 35 on which a circuit component 34 is mounted. In this case, the flexible substrate 35 is folded by a folding part 53 so that first and second soldered parts 54 and 55 partially overlap with each other, and the lead terminal 46 of the hologram laser 31 is inserted into a through-hole formed in the first and/or second soldered parts 54, 55 to be soldered to a land disposed around the through-hole. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
