| 摘要 |
PROBLEM TO BE SOLVED: To provide a halogen-free flame-retardant resin composition suppressing cracks near a through-hole even under severe conditions without emitting hydrogen bromide which is a toxic gas during combustion and to provide prepreg, a laminate, a copper-clad laminate and a printed wiring board using the composition. SOLUTION: The halogen-free flame-retardant resin composition consists essentially of (A) a condensed type phosphoric ester compound represented by formula 1 or a phenoxyphosphazene compound, (B) a cyclopentadiene type epoxy resin represented by formula 2, (C) a nitrogen-containing curing agent for the epoxy resin and (D) an inorganic filler. The prepreg, laminate, copper-clad laminate and printed wiring board comprise the resin composition. COPYRIGHT: (C)2005,JPO&NCIPI |
