Resin composition having high dielectric constant and uses thereof

摘要

The subject invention relates to a resin composition having a high dielectric constant, comprising (a) an epoxy resin, (b) a curing agent, (c) a ceramic powder, and (d) a highly polar modifier. The subject invention further relates to a process for the manufacture of a printed circuit board comprising using the composition of the subject invention as a material for a capacitor material embedded in the printed circuit board.