| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that can be reduced in manufacturing cost and a method of manufacturing the same. <P>SOLUTION: A lower chip 4 is mounted on an island 3 of a lead frame 2, an upper chip 5 is mounted on the lower chip 4, and gold bumps 7 and gold bumps 8 are formed beforehand on the pads of the lower chip 4 and the upper chip 5, respectively. The lower chip 4 and the upper chip 5 are connected to each other by bonding via thin gold wires 9, and the lower chip 4 and the lead 2 are connected to each other by bonding via thick gold wires 6. Subsequently, resin sealing is performed using a resin 10 and the lead of the lead frame 2 is cut and formed into a desired shape, so that a semiconductor device 1 is obtained. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
