发明名称 HOLDING JIG OF WIRING BOARD, AND MANUFACTURING METHOD OF WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a holding jig of a wiring board and the manufacturing method of the wiring board wherein the workability of the holding jig is so improved and the deformation of the wiring board is so prevented as to obtain the improvements of their reliabilities, by securing the adhesively fastening effect of the holding jig to the wiring board, and by facilitating the peeling of the holding jig from the completed wiring board. SOLUTION: In an adhesive plate P (the holding jig of a wiring board), an adhesive layer 2 is so formed on the surface of a jig-main-body 1 comprising a plate as to fasten adhesively in a peelable way a wiring board S to the adhesive layer. In this case, the jig-main-body and the adhesive layer are so divided into a plurality of small-piece portions p that the opposite surfaces of the small-piece portions to the adhesively fastened surface of the wiring board are joined integrally with each other by an adhesive sheet 11 made of a sheet material having a flexibility. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005012122(A) 申请公布日期 2005.01.13
申请号 JP20030177070 申请日期 2003.06.20
申请人 TOSHIBA CORP 发明人 YAMAMOTO TETSUYA
分类号 H05K3/34;(IPC1-7):H05K3/34 主分类号 H05K3/34
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