| 摘要 |
PROBLEM TO BE SOLVED: To reduce price of a product by miniaturizing a device, reducing the number of parts items, and reducing the number of assembling processes of the device. SOLUTION: Since at least an outer surface of a pick-up roller 13 is formed from a buffer member, even if the pick-up roller 13 is sprung up to abut on a cover 26 of a device main body 15, the pick-up roller 13 itself can absorb an impact to be generated when the pick-up roller 13 collides with the cover 26, and the collision noise when the pick-up roller 13 collides with the cover 26 can be relaxed. Since the pick-up roller 13 itself can absorb the impact when colliding, a buffer pad or the like to be separately fitted to a colliding position of the pick-up roller 13 is unnecessary. COPYRIGHT: (C)2005,JPO&NCIPI
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