| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device by which a sticking work of an adhesive sheet to a semiconductor wafer, expanding operation, and chip picking-up operation can be performed smoothly. <P>SOLUTION: A first adhesive sheet 11 composed of a substrate 1 and a first adhesive layer 2 formed on the substrate 1, and a second adhesive layer 12 composed of a stiff layer 3 and a second adhesive layer 4 formed on the layer 3, are prepared. Then the second adhesive layer 4 side of the second adhesive sheet 12 is stuck to the semiconductor wafer 7, and the peripheral edge of the sheet 12 is cut off so that the sheet 12 may have a shape which is almost equal to that of the wafer 7. In addition, the first adhesive sheet 11 having a larger diameter than the wafer 7 has is stuck to the stiff layer 3 of the second adhesive sheet 12. The second adhesive layer 4, stiff layer 3, and first adhesive layer 2 are cut by dicing and expanded to the same shape as that of an IC chip after the peripheral edge of the first adhesive sheet 11 is fixed by means of a ring frame 6. Thereafter, the first adhesive layer 2 is picked up after the layer 2 is stuck to and left on the rear surface of the IC chip and thermocompression bonded to the surface of a die pad section. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
