发明名称 METHOD AND APPARATUS FOR PARTIALLY COATING PARTING COMPOUND ON SURFACE OF SUBSTRATE BY EVAPORATOR
摘要 PURPOSE: To provide a method and apparatus for partial coating of parting compound, the method and apparatus for constantly maintaining vaporization temperature and properly changing an amount of vaporized steam discharge from nozzles using reserve stock of liquid phase parting compound and immediately stopping outflow of vaporized steam as occasion demands. CONSTITUTION: In an apparatus for partially coating the parting compound on a substrate(10) moved in a vacuum chamber with at least one or more a metal evaporators(33) by an evaporator(1) capable heating a parting compound for hindering metallization coating, the parting compound-evaporator(1) comprising a first chamber(2) having at least one or more electric heating bodies(3) for vaporizing the parting compound; and a second chamber(6) comprising at least one or more nozzles(8) which is parallel to the first chamber, connected to the first chamber and directed to the substrate, and a second chamber(6) with at least one or more control valves(12) for blocking inflow of the parting compound, the apparatus for partial coating of the parting compound is characterized in that (a) the at least one or more control valves mounted between the first chamber and the second chamber are consisted of one proportional valve, (b) the control valves are mounted respective conduits(11) of the parting compound-evaporator to play a role of connecting the first and second chambers, and (c) the control valves are formed in such a manner that the control valves not only quantitatively and selectively adjust vaporized steam flow of the parting compound, but also completely stop the vaporized steam flow thereof.
申请公布号 KR20050003983(A) 申请公布日期 2005.01.12
申请号 KR20040017236 申请日期 2004.03.15
申请人 APPLIED FILMS GMBH & CO. KG 发明人 HEIN, STEFAN
分类号 B05D1/32;C23C14/04;C23C14/22;C23C14/24;H01G13/00;(IPC1-7):C23C14/22 主分类号 B05D1/32
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