发明名称 WIRING PATTERN INSPECTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a method for easily measuring the width of a fine wiring pattern containing a step on a substrate, using an imaging system comprising a focal adjusting function which uses an automatic laser beam focusing system with no use of an offset means. SOLUTION: A pattern 2 for focusing which has the same height with the surface of a fine wiring pattern containing a step provided on a substrate is provided on the substrate in advance. By focusing with an imaging system on the surface of the focusing pattern 2, the width of such wiring pattern is inspected as is not conventionally focused nor sufficiently inspected with an offset means. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005003600(A) 申请公布日期 2005.01.06
申请号 JP20030169345 申请日期 2003.06.13
申请人 HITACHI CHEM CO LTD 发明人 YAMAMOTO REI
分类号 G01B11/02;G02B7/28;H01L21/66;(IPC1-7):G01B11/02 主分类号 G01B11/02
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