发明名称 COMPONENT MOUNTING DEVICE AND TAPE-LIKE SUBSTRATE LOADING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a component mounting device and a tape-like substrate loading method with which a tape-like substrate can be loaded on the component mounting device in short time without need of an expert at the time of loading the tape-like substrate. <P>SOLUTION: In the component mounting device, a conveyance means having two fixed clamps and two moving clamps arranged between the two fixed clamps mounts a component on electrodes on respective substrates while it stepwise conveys the tape-like substrate T where the individual substrates are connected in a tape shape. Scraping arms 40A and 40B which are extended to the upstream-side or the downstream-side from the moving clamp 23 and can be engaged with ends of the tape-like substrate are arranged at least at one of the moving clamps. Pawls 50A and 50B that the arms have are engaged with recessed parts 32A and 32B of a reader plate 30, which are fitted to ends of the tape-like substrate. The tape-like substrate is automatically loaded by movement of the moving clamps. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005005474(A) 申请公布日期 2005.01.06
申请号 JP20030167052 申请日期 2003.06.11
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 WADA NAOYUKI;HONGO HIDEO;SAITO KAZUE
分类号 H05K13/04 主分类号 H05K13/04
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