| 摘要 |
The invention relates to methods and devices for electroplating holes, blind holes and structures, preferably in and on printed circuit boards. According to known methods for electroplating holes, the main parts of the surfaces are metallised, which is undesirable. Said invention combines the electrolytic action of various anode/cathode distances with respectively different polarities of the bath current in two treatment steps. Both steps are marked with the distances of the electrodes and the polarity of the bath current source in figures 1a and 1b. The surface and the holes are metallised when the anode/cathode distance of product 1 and from the electrode 2 is large. When the anode/cathode distance is small, the surface, but not the holes, is predominately demetallised. As a result, the holes are predominately metalised and not the surfaces. |
