Semiconductor package with an optical sensor which may be fit inside an object

摘要

The package has a body that encloses an integrated circuit chip (5) presenting an optical sensor and installed in interior of an object e.g. portable telephone, presenting two parts. A plate having electric connection tracks is disposed in the object. The body has electric connection pins (6) that are supported respectively on the tracks and coupled to the chip. A front support surface of the body couples the two object parts.