发明名称 |
Thermally isolating optical devices |
摘要 |
A thermo-optic device may be formed with trenches that undercut the substrate beneath the thermo-optic device. Through the removal of the underlying substrate, the heat dissipation of the thermo-optic device may be reduced. This may reduce the thermal budget of the device, reducing the power requirements for operating the device in some embodiments.
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申请公布号 |
US2004258344(A1) |
申请公布日期 |
2004.12.23 |
申请号 |
US20030465210 |
申请日期 |
2003.06.19 |
申请人 |
FARDI BEHZAD;ADIBI FARSHID;LI CHAOYANG;BANDYOPADHYAY ANIRBAN;JUNNARKAR MAHESH |
发明人 |
FARDI BEHZAD;ADIBI FARSHID;LI CHAOYANG;BANDYOPADHYAY ANIRBAN;JUNNARKAR MAHESH |
分类号 |
G02F1/01;G02F1/025;(IPC1-7):G02B6/12 |
主分类号 |
G02F1/01 |
代理机构 |
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