发明名称 ELECTRONIC DEVICE
摘要 PURPOSE:To prevent the bonding strength of a wire to the electrode of a pellet from decreasing and the resistance value from increasing by covering a bonded part of the pellet to a bonding wire with a high purity resin. CONSTITUTION:Since a bonded part 11 of a copper wire 10 to an aluminum electrode 9 is covered by a protecting part 12 made of high purity resin, the part 11 is not contacted with impurities which cause the copper-aluminum to be corroded to prevent the resistance value from increasing. Here, it is necessary to set the thickness of the part 12 to prevent the impurity 14 in the low purity resin for surrounding the part 12 made of high purity resin in a package 13 from being impregnated to the part 12 to arrive at the bonded part 11 at the center of the part 12.
申请公布号 JPS6352452(A) 申请公布日期 1988.03.05
申请号 JP19860195430 申请日期 1986.08.22
申请人 HITACHI LTD;HITACHI TOBU SEMICONDUCTOR LTD 发明人 TSURUMARU KAZUHIRO;FURUI TAKAFUMI
分类号 H01L23/29;H01L21/60;H01L23/31 主分类号 H01L23/29
代理机构 代理人
主权项
地址