| 摘要 |
PROBLEM TO BE SOLVED: To provide a low thermal expansion laminated sheet suitable for manufacturing a package substrate of high reliability and reduced not only in warpage, twist deformation and the like but also in thermal expansion and contraction, and its manufacturing method. SOLUTION: This alloy foil laminated sheet is manufactured using an alloy foil having the coefficient of thermal expansion near to that of Si and a prepreg of which the coefficient of thermal expansion is 15 ppm/°C or below. COPYRIGHT: (C)2005,JPO&NCIPI
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