| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for housing a semiconductor element which has a high heat dissipation property, has a small transmission loss of high frequency signals, has an improved connection reliability of spherical terminals, and is suitable for mounting a semiconductor element for high frequencies which consumes a large amount of power; and also to provide a semiconductor device. SOLUTION: The package for housing a semiconductor element comprises an insulation substrate 1 having a through-hole formed inside to house and locate a semiconductor element 2, a wiring pad located around the through-hole on one principal plane of the insulation substrate 1, electrode pads located on the other principal plane of the insulation substrate 1, spherical terminals 6 mounted on the electrode pad, and metallic heat slinger 5 which is mounted on the other principal plane of the insulation substrate 1 and is formed with cutouts or through-holes to house the spherical terminals 6 in a non-contact state. The heat slinger 5 is so mounted as to cover almost all the other principal plane, and has a thickness of 1/16 or less of a wavelength of high frequency signals inputted into or output from the semiconductor element 2. COPYRIGHT: (C)2005,JPO&NCIPI |
