| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation, free from halogen-based flame-retardant and antimony compound, and containing a yellow colorant having good moldability, flame-retardance and heat-resistance resistant to discoloration at high temperature and provide a semiconductor device produced by using the composition. SOLUTION: The epoxy resin composition for semiconductor encapsulation contains (A) an epoxy resin, (B) a phenol-novolak resin hardener, (C) a cure accelerator, (D) an inorganic filler, (E) aluminum hydroxide and (F) yellow iron oxide as essential components. The amounts of the aluminum hydroxide and the yellow iron oxide in the total epoxy resin composition are 1-20 wt.% and 0.1-3 wt.%, respectively. COPYRIGHT: (C)2005,JPO&NCIPI
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