| 摘要 |
A solid-state semiconductor light emitting device is disclosed. A heat sink 30 that comprises a receiving cup 31 for receiving a chip 50 is provided. A leadframe 40 that comprises a connection base 47 is mounted above the heat sink 30, wherein the chip 50 is connected to the leadframe 40 via a metal wire and a resin or silicone is applied to cover all of them so as to form the a light emitting device that emits light. In the leadframe 40, two holders 41,43 that include two top sides on their two top portions are opposite to one another, and a holder 45 having holes 46 is mounted between these two top sides. The holder 45 having the holes 46 is connected to one of these two opposite holders 41,43. A plastic material is applied to mold the three holders 41,43,45 into the connection base 47 for receiving the receiving cup 31 of the heat sink 30. As a result, the heat sink 30 provides good heat-dissipating efficacy and each holder 41,43,45 of the leadframe 40 also provides heat-dissipating efficacy and enhances connection stability as well. |
