| 摘要 |
PROBLEM TO BE SOLVED: To improve the coverage of a metallic film formed on a fine pattern. SOLUTION: The film-forming method for forming the metallic film on a substrate Wf to be treated comprises a first step of supplying the gas of a metal carbonyl compound onto the substrate Wf, and a second step of supplying the gas of an organic compound for forming a coordination compound on the substrate. COPYRIGHT: (C)2005,JPO&NCIPI
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