FOREIGN MATTER INSPECTION DEVICE, FOREIGN MATTER INSPECTION METHOD, AND FOREIGN MATTER INSPECTION PROGRAM

摘要

PROBLEM TO BE SOLVED: To accurately find the height of foreign matter on a semiconductor wafer by simple processing. SOLUTION: Incident light Oi outputted from a laser light source 1 is obliquely inlet into the wafer W. Regular reflection light Or reflected by the wafer W is received by a light receiver 3 while side-way scattered light Os scattered by the wafer W is received by a light receiver 4. The foreign matter P is specified from the scattered light Os while the height of the foreign matter P is found from the reflection light Or. COPYRIGHT: (C)2005,JPO&NCIPI