| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad which improves flattening of the surface of a semiconductor device to easily perform fine working for increasing resolution on the surface of the semiconductor device. <P>SOLUTION: This polishing pad is used for polishing a polishing object by being adhered to a polishing plate. In the pad, at least two or more curved grooves which do not mutually cross are formed on the surface and the curves are characterized by curves except a closed curve. The pad is adhered to the rotating polishing plate, and the polishing object is held in a state of the surface being confronted with the pad by a holder rotated by being deviated from a rotation center of the polishing plate on an upper side of the polishing plate. Polishing agent is supplied to the pad, and the polishing plate and the holder are rotated, to polish the polishing object. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
