| 发明名称 |
Methods for positioning and bonding elements in substrates |
| 摘要 |
Devices and techniques for placing and bonding identical elements to holes in a substrate where spacer balls and a reference surface are used to achieve the desired accuracy.
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| 申请公布号 |
US6826928(B2) |
申请公布日期 |
2004.12.07 |
| 申请号 |
US20020101805 |
申请日期 |
2002.03.19 |
| 申请人 |
TERASTOR CORPORATION |
发明人 |
BERG JOHN;KINDLER DAVID J.;KENT DAVID;BUSWELL DAVID |
| 分类号 |
B23P19/12;H01L21/00;H01L21/68;(IPC1-7):C03C27/00 |
主分类号 |
B23P19/12 |
| 代理机构 |
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