发明名称 |
Method and apparatus for controlling material removal from semiconductor substrate using induced current endpointing |
摘要 |
A method and apparatus for controlling the removal of material from a semiconductor substrate in an integrated circuit fabrication process is disclosed. The method and apparatus utilize a light source or charged particle beam (electron or ion beam) to induce a current in at least one P-N junction formed in the semiconductor substrate. The induced current is monitored during the removal of material and the process is stopped or endpointed in response to the induced current making a predetermined transition.
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申请公布号 |
US2004241999(A1) |
申请公布日期 |
2004.12.02 |
申请号 |
US20040868245 |
申请日期 |
2004.06.15 |
申请人 |
INTEL CORPORATION |
发明人 |
LIVENGOOD RICHARD H.;WINER PAUL;WOODS GARY;DIBATTISTA MICHAEL |
分类号 |
H01L21/00;H01L21/66;(IPC1-7):H01L21/302;H01L21/461 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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