发明名称 Lead-free copper alloy and a method of manufacture
摘要 A lead-free copper alloy on the base of Cu-Zn-Sn and a method of manufacture. The copper alloy is built on the base of copper, zinc and tin without toxic additives and consists of: 60 to 70% Cu, 0.5 to 3.5% Sn and the further matrix-active elements: 0.01 to 0.5% Fe and/or Co, 0.01 to 0.5% Ni, 0.01 to 0.5% Mn and/or Si, the remainder Zn and unavoidable impurities. Selectively up to 3% Mg, up to 0.2% P and up to 0.5% Ag, Al, As, Sb, Ti, Zr can be added. The demands for a health-conscious and ecological compatibility are thus naturally met.
申请公布号 US2004241038(A1) 申请公布日期 2004.12.02
申请号 US20040786470 申请日期 2004.02.25
申请人 HOFMANN UWE;BREU MONIKA;SIEGELE HARALD;BOEGEL ANDREAS;HUMPENOEDER-BOEGEL DORIS;SEEGER JOERG 发明人 HOFMANN UWE;BREU MONIKA;SIEGELE HARALD;BOEGEL ANDREAS;HUMPENOEDER-BOEGEL DORIS;SEEGER JOERG
分类号 C22C9/02;C22C9/04;F16C33/12;(IPC1-7):C22C9/04 主分类号 C22C9/02
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