发明名称 ELECTROLYTIC TREATMENT DEVICE AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electrolitic treatment device capable of producing products with various specifications in a state of the highest productivity while considering the quantity of the production, reducing production cost, and being applied even to the miniaturization of wirings flexibly. SOLUTION: The electrolytic treatment device is equipped with: an electrolytic treatment unit 30 provided with a substrate holding part 40 of holding a substrate; and a counter plate 50 arranged at a position confronted with the substrate held by the substrate holding part 40; an elecyrolytic treatment unit 30 in which power is fed to the space between the substrate held by the substrate holding part 40 and the counter plate while an electrolytic solution is filled therein, and electrolytic treatment is performed; and a plurality of electrolytic solution feeding equipments 32a and 32b of feeding different kinds of electrolytic solutions. The electrolytic treatment unit 30 is constituted so as to alternatively be connected to one of the electrolytic solution feeding equipments 32a and 32b. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004339579(A) 申请公布日期 2004.12.02
申请号 JP20030138521 申请日期 2003.05.16
申请人 EBARA CORP 发明人 MISHIMA KOJI;NAMIKI KEISUKE;HOUDAI MASAO;KUNISAWA JUNJI;MAKINO NATSUKI;FUKUNAGA YUKIO
分类号 C25D7/12;C25B9/00;C25D17/00;C25D17/02;C25D19/00;C25D21/00;(IPC1-7):C25D17/00 主分类号 C25D7/12
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