| 摘要 |
An integrated circuit packaging method includes applying an under bump metalization (UBM) layer over an electrical contact pad surface, and any intervening layers, of an integrated circuit die, and applying, such as by soldering, a surface mount component directly to the integrated circuit die by applying the surface mount component to the UBM layer. This provides a direct electrical and mechanical coupling of the surface mount component to the integrated circuit die since the surface mount component is directly electrically connected with the electrical contact pad of the integrated circuit die. As such, impedance may be reduced and the coefficient of thermal mismatch between silicon integrated dies and the surface mount component may be minimized. |
