发明名称 |
Thermoelektrische Kühlvorrichtung |
摘要 |
<p>The present invention provides a thermoelectric cooling apparatus for cooling an electronic device such as a CPU, or a computer chip. The apparatus cools the electronic device by two stages. In the first stage, a heat absorbing block collects the heat produced by the electronic device and the apparatus pre-cools the electronic device by dissipating a portion of the collected heat in a distant location through a front heat conductive device and a front radiator. Thereby the heat of the electronic device is reduced to a degree that a TEC can efficiently handle. In the second stage, a TEC of the apparatus dissipate the residual of the heat produced by the electronic device through at least a back heat pipe and a back radiator.</p> |
申请公布号 |
DE202004010951(U1) |
申请公布日期 |
2004.12.02 |
申请号 |
DE20042010951U |
申请日期 |
2004.07.13 |
申请人 |
GIGA-BYTE TECHNOLOGY CO., LTD. |
发明人 |
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分类号 |
F25B21/02;F25B25/00;H01L23/38;H01L23/427;H01L23/467;H01L35/30;(IPC1-7):F25B21/02 |
主分类号 |
F25B21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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