摘要 |
A substrate polishing apparatus (10) polishes a substrate (20) to a flat mirror finish. The substrate polishing apparatus (10) has a polishing table (12) against which a substrate (20) is pressed, a light-emitting and light-receiving device (24) to emit measurement light from the polishing table (12) to the substrate (20) and to receive reflected light from the substrate (20) for measuring a film on the substrate (20), a fluid supply passage (42) for supplying a measurement fluid, through which the measurement light and the reflected light pass, to a fluid chamber (68) provided at a light-emitting and light-receiving position of the polishing table (12), and a fluid supply control device (56, 58) for controlling supply of the measurement fluid to the fluid chamber (68). |
申请人 |
EBARA CORPORATION;SHIMADZU CORPORATION;HIROKAWA, KAZUTO;KOBAYASHI, YOICHI;NAKAI, SHUNSUKE;OHTA, SHINROU;TSUKUDA, YASUO |
发明人 |
HIROKAWA, KAZUTO;KOBAYASHI, YOICHI;NAKAI, SHUNSUKE;OHTA, SHINROU;TSUKUDA, YASUO |