| 摘要 |
The device has a pad electrode (53) disposed on a surface of a semiconductor die and covering an end of a via hole. A supporting substrate is bonded to the surface of the die. A wiring layer (64) is formed on another surface of the die and is connected with the pad electrode through the via hole. A conductive terminal is formed on a portion of the wiring layer covering a convex portion of the die. An independent claim is also included for a method of manufacturing a semiconductor device. |
