发明名称 LASER BEAM MACHINING SYSTEM
摘要 <p><P>PROBLEM TO BE SOLVED: To enhance the machining quality by specifying the laser beam irradiation position at high accuracy even when any positional deviation or the like occurs by the carriage of a medium to be machined in a continuous state in a laser beam machining system to perform machining by the laser beam irradiation based on the predetermined machining data when a machining area of the medium in a continuous state to be carried reaches a laser beam irradiation area. <P>SOLUTION: An obliquing means 19 to guide the continuous medium at the angleθof inclination according to the scanning angleθof laser beam irradiation by a laser beam irradiation means 21 is provided on a carrying passage of the continuous medium 14, and an oblique release means 20 to guide the condition of the continuous medium 14 so as to return the medium in a carrying state before the medium obliques by the obliquing means 19 at the inverse angleθof inclination symmetric to the angleθof inclination of the obliquing means 19 is provided. Laser beam irradiation is performed, for example, on the obliquing means 19. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2004330198(A) 申请公布日期 2004.11.25
申请号 JP20030124791 申请日期 2003.04.30
申请人 TOPPAN FORMS CO LTD 发明人 SUZUKI HIDEKI;HIROHATA WATARU
分类号 B65H23/26;B23K26/08;B23K101/16;B65H23/32;(IPC1-7):B23K26/08 主分类号 B65H23/26
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