| 摘要 |
PROBLEM TO BE SOLVED: To enable the occurrence of a sticking phenomenon accompanying a substrate as an object of processing, such as a wafer or the like, to be detected before performing an operation, such as the operation of a push pin or the like, for unloading the wafer from a processing chamber. SOLUTION: A substrate processing device ( semiconductor processing device) which subjects a target substrate (wafer 2) placed on the mounting surface 30 of a stage 1 to prescribed processing is equipped with the stage 1 mounted with the wafer 2 on its mounting surface 30, a vibrator 5 which transmits ultrasonic signals to the mounting surface 30 of the stage 1, and a detector 6 which detects the reflected signals of the transmitted ultrasonic signals. Signals reflected from the end face of the wafer 2 other than the mounting surface 30 of the stage 1 are detected so as to detect that the wafer 2 is stuck to the stage 1. COPYRIGHT: (C)2005,JPO&NCIPI |
