| 摘要 |
<P>PROBLEM TO BE SOLVED: To optimize the heat sink properties, weight, costs, machinability, and other characteristics of a heat sink element. <P>SOLUTION: An application specific heat sink element 900, which is designed to dissipate heat from electronic components 1144 and 1154, has heat sink substrates 910 and 1143 selected on the basis of at least one of size, shape, mass, costs, heat conductance, and environmental resistance, and heat sink studs 920, 930, 1145, and 1155 selected on the basis of CTE and machinability. The heat sink studs are installed to the heat sink substrates so that the electronic components can be installed on the heat sink studs. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
