发明名称 Method and apparatus for temperature compensation
摘要 Temperature compensation is achieved by adjusting a divide ratio of a multi-modulus divider circuit in a feedback path of a phase-locked loop based on the detected temperature. The divide ratio is adjusted based on stored adjustment values stored in non-volatile memory. Interpolation may be used to interpolate between the stored adjustment values.
申请公布号 US2004232997(A1) 申请公布日期 2004.11.25
申请号 US20040878196 申请日期 2004.06.28
申请人 SILICON LABORATORIES INC. 发明人 HEIN JERRELL P.;THOMSEN AXEL
分类号 H03L1/02;H03L7/095;H03L7/099;H03L7/197;H03L7/23;(IPC1-7):H03L7/00 主分类号 H03L1/02
代理机构 代理人
主权项
地址