发明名称 |
Method and apparatus for temperature compensation |
摘要 |
Temperature compensation is achieved by adjusting a divide ratio of a multi-modulus divider circuit in a feedback path of a phase-locked loop based on the detected temperature. The divide ratio is adjusted based on stored adjustment values stored in non-volatile memory. Interpolation may be used to interpolate between the stored adjustment values.
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申请公布号 |
US2004232997(A1) |
申请公布日期 |
2004.11.25 |
申请号 |
US20040878196 |
申请日期 |
2004.06.28 |
申请人 |
SILICON LABORATORIES INC. |
发明人 |
HEIN JERRELL P.;THOMSEN AXEL |
分类号 |
H03L1/02;H03L7/095;H03L7/099;H03L7/197;H03L7/23;(IPC1-7):H03L7/00 |
主分类号 |
H03L1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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