| 摘要 |
PROBLEM TO BE SOLVED: To provide an easy-to-manufacture electronic device and its manufacturing method, a package for realizing that electronic device, a base substrate and its manufacturing process. SOLUTION: In the electronic device 1 where an electronic element (SAW element 13) is mounted in the cavity 5 of a base substrate (arranged with a plurality of packages 2 two-dimensionally) produced by pasting an upper layer substrate 3 and a lower layer substrate 4 and a cover 15 is secured to the opening of the cavity 5 by means of resin or a washer 16 such as a conductor, a castellation 8 is formed only on the upper layer substrate 3. Consequently, a level difference is provided by the lower layer substrate 4 at the lower part of the castellation 8. The washer 16a flowing out when the cover 15 is bonded by hot press is thereby dammed at the level difference part. COPYRIGHT: (C)2005,JPO&NCIPI
|
